{"data":{"stock":{"id":293,"stock_code":"2344","stock_name":"華邦電","market_type":"上市","industry_code":"24","industry_name":"24","industry_id":1,"company_type":"上市股票","listing_date":"1995-10-18","established_date":"1987-09-29","capital":45000001930,"chairman":"焦佑鈞","general_manager":"陳沛銘","spokesperson":"范祥雲","company_address":"台中市大雅區中部科學園區科雅一路8號","company_url":"WWW.WINBOND.COM","source":"TWSE OpenAPI","source_url":"https://openapi.twse.com.tw/v1/opendata/t187ap03_L","last_updated_at":"2026-06-24T20:10:01.147Z"},"latest_price":{"id":300,"stock_id":293,"trade_date":"2026-06-23","open_price":219,"high_price":222,"low_price":205.5,"close_price":211.5,"change_price":-10.5,"change_percent":-4.72972972972973,"volume":263314980,"turnover_value":56076307281,"transaction_count":179360,"market_type":"上市","source":"TWSE OpenAPI","source_url":"https://openapi.twse.com.tw/v1/exchangeReport/STOCK_DAY_ALL","created_at":"2026-06-24T20:12:10.249Z"},"latest_revenue":null,"latest_financial":null,"latest_institutional":null,"themes":[{"id":1571,"theme_name":"HBM","theme_category":"半導體先進製程","description":"高頻寬記憶體與 DRAM 供應鏈","keywords":"HBM,DRAM,記憶體","source":"auto-theme-rule-v1","source_url":"scripts/sync-twse-to-cloudflare.mjs","last_updated_at":"2026-06-25T03:13:13.317Z","relation_strength":"強","reason":"AI 記憶體、DRAM、封裝材料或設備受惠鏈"},{"id":1572,"theme_name":"IC 設計","theme_category":"半導體先進製程","description":"晶片設計公司，涵蓋手機、網通、消費、驅動 IC 與 ASIC","keywords":"IC設計,ASIC,SoC","source":"auto-theme-rule-v1","source_url":"scripts/sync-twse-to-cloudflare.mjs","last_updated_at":"2026-06-25T03:13:13.317Z","relation_strength":"弱","reason":"依官方產業分類與代表股規則自動標註"},{"id":1569,"theme_name":"半導體","theme_category":"半導體先進製程","description":"半導體製造、設計、封測與設備材料","keywords":"半導體,IC,封測","source":"auto-theme-rule-v1","source_url":"scripts/sync-twse-to-cloudflare.mjs","last_updated_at":"2026-06-25T03:13:13.317Z","relation_strength":"中","reason":"依官方產業分類與代表股規則自動標註"}],"supply_chain_roles":[{"id":2994,"stock_id":293,"theme_id":1571,"role_type":"記憶體 / 材料設備","role_description":"華邦電 在 HBM 題材中屬於記憶體 / 材料設備","major_products":null,"major_customers":null,"confidence_score":88,"source":"auto-theme-rule-v1","source_url":"scripts/sync-twse-to-cloudflare.mjs","updated_at":"2026-06-25T03:13:07.038Z","theme_name":"HBM"},{"id":1540,"stock_id":293,"theme_id":1569,"role_type":"官方產業分類","role_description":"華邦電 在 半導體 題材中屬於官方產業分類","major_products":null,"major_customers":null,"confidence_score":68,"source":"auto-theme-rule-v1","source_url":"scripts/sync-twse-to-cloudflare.mjs","updated_at":"2026-06-25T03:10:18.918Z","theme_name":"半導體"},{"id":1541,"stock_id":293,"theme_id":1572,"role_type":"半導體供應鏈","role_description":"華邦電 在 IC 設計 題材中屬於半導體供應鏈","major_products":null,"major_customers":null,"confidence_score":52,"source":"auto-theme-rule-v1","source_url":"scripts/sync-twse-to-cloudflare.mjs","updated_at":"2026-06-25T03:10:18.918Z","theme_name":"IC 設計"}],"score":null},"meta":{"updated_at":"2026-06-25T06:20:56.046Z","source":"cloudflare-d1","is_realtime":false}}